Light emitting device package

ABSTRACT

A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of application Ser. No. 12/622,613filed on Nov. 20, 2009 now U.S. Pat. No. 8,188,498, which claimspriority to Korean Application No. 10-2008-0117579 filed on Nov. 25,2008. The entire contents of all of the above applications are herebyincorporated by reference.

BACKGROUND OF THE INVENTION

Embodiments of the invention relate to a light emitting device package.

Group III-V nitride semiconductors have been in the spotlight as a corematerial for light emitting devices, such as light emitting diodes(LEDs), laser diodes (LDs), and the like, because of their excellentphysical and chemical properties. Group III-V nitride semiconductors arecomposed of a semiconductor material having the chemical formula ofIn_(x)Al_(y)Ga_(1-x-y)N (where 0≦x≦1, 0≦y≦1, 0≦x+y≦1). LEDs are a kindof semiconductor device that converts electricity into infrared rays orlight by using characteristics of a compound semiconductor to transmitand receive a signal, and they are used as light sources.

LEDs or LDs made of nitride semiconductor materials are widely adoptedin light emitting devices for obtaining light, and are applied as lightsources for various products, for example, a light emission part for akeypad of a mobile phone, an electrical sign board, and a lightingdevice.

SUMMARY OF THE INVENTION

Embodiments provide a light emitting device package in which a wire anda light emitting device are disposed within one cavity.

Embodiments provide a light emitting device package in which a lightemitting device and one wire are disposed in a phosphor layer disposedwithin a cavity.

Embodiments provide a light emitting device package in which a leadelectrode is formed by one cavity of a multi-layered cavity.

Embodiments provide a light emitting device package in which at leastone lead electrode is exposed to a bottom surface of a package body.

An embodiment provides a light emitting device package including apackage body comprising a first cavity, and a second cavity connected tothe first cavity; a first lead electrode, at least a portion of which isdisposed within the second cavity; a second lead electrode, at least aportion of which is disposed within the first cavity; a light emittingdevice disposed within the second cavity; a first wire disposed withinthe second cavity, the first wire electrically connecting the lightemitting device to the first lead electrode; and a second wireelectrically connecting the light emitting device to the second leadelectrode.

An embodiment provides a light emitting device package including apackage body comprising a first cavity having an opened upper portionand a second cavity connected to the first cavity; a first leadelectrode, a first portion of the first lead electrode extending along abottom of the package body within the second cavity and a second portionof the first lead electrode extending along a lower portion of the firstcavity; a portion of a second lead electrode disposed within the firstcavity; and a light emitting device disposed on the first leadelectrode.

An embodiment provides a light emitting device package including apackage body comprising a first cavity having an opened upper portion,and a second cavity connected to the first cavity at a lower portionthereof; a first lead electrode having a portion which cups the secondcavity, the first lead electrode extending from the package body towarda first direction; a second lead electrode having a surface exposed tothe first cavity; a light emitting device disposed within the secondcavity; a first wire which electrically connects the first leadelectrode to the light emitting device and disposed within the secondcavity; and a phosphor layer disposed within the second cavity.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features will be apparent fromthe description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a light emitting device package according to afirst embodiment.

FIG. 2 is a side sectional view taken along line A-A of FIG. 1.

FIG. 3 is a side sectional view taken along line B-B of FIG. 1.

FIG. 4 is a plan view of a light emitting device according to a secondembodiment.

FIG. 5 is a plan view of a light emitting device according to a thirdembodiment.

FIG. 6 is a plan view of a light emitting device according to a fourthembodiment.

FIG. 7 is a side view of a light emitting device according to a fifthembodiment.

FIG. 8 is a plan view of a light emitting device according to a sixthembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the embodiments of the presentdisclosure, examples of which are illustrated in the accompanyingdrawings. In the description, a size and a thickness of each layer inthe accompanying drawings is illustrated as an example, and thus, arenot limited thereto.

FIG. 1 is a plan view of a light emitting device package according to afirst embodiment. FIG. 2 is a side sectional view taken along line A-Aof FIG. 1, and FIG. 3 is a side sectional view taken along line B-B ofFIG. 1.

Referring to FIGS. 1 to 3, a light emitting package 100 including apackage body 110, a first cavity 112, a second cavity 115, leadelectrodes 121 and 123, at least one light emitting device 130 (e.g., aplurality of light emitting devices 130), a phosphor layer 140, and aresin layer 150.

The package body 110 may include one of a printed circuit board (PCB)type substrate, a ceramic type substrate, and a lead frame typesubstrate. The package body 110 may have an injection molding structureusing a resin material or a stacked structure, but is not limitedthereto. Hereinafter, for convenience of description, the lead frametype substrate will be described in the following embodiments as anexample. The package body 110 may be integrally injection-molded usingthe resin material (e.g., polyphthalamide (PPA)) or a material having ahigh reflective characteristic.

The package body 110 may be formed of the resin material such aspolycarbonate (PC) and PPA, a silicon material, or a ceramic material.The package body 110 may have the injection molding structure or thestacked structure.

A plurality of lead electrodes 121 and 123 is disposed on the packagebody 110. The lead electrodes 121 and 123 may include at least one of aPCB type electrode, a ceramic type electrode, a lead frame typeelectrode, and a via type electrode. Hereinafter, for convenience ofdescription, the lead frame type electrode will be described in thefollowing embodiments as an example.

The first cavity 112 and the second cavity 115 are formed in the packagebody 110. The first cavity 112 has an opened upper side, and the secondcavity 115 is defined at a predetermined position under the first cavity112. As shown, a portion of the bottom of the first cavity 112 isdefined by an annular surface of the package body with an opening in acentral portion thereof.

A surface of the first cavity 112 may have a circular shape, a polygonalshape, an oval shape, or any other shape, and the first cavity 112 mayhave a predetermined depth. A circumferential surface of the firstcavity 112 may be perpendicular to a bottom surface thereof or inclinedoutwardly (or inwardly) at a predetermined angle.

The second cavity 115 is formed under a central portion of the firstcavity 112 in the central portion to the annular surface of the packagebody that defines the bottom of the first cavity, at approximately theline B-B of FIG. 1, but such is not required. The size of the secondcavity 115 may be smaller than the size of the first cavity 112. Asurface of the second cavity 115 may have a circular shape, an ovalshape, a polygonal shape, or other shapes. The second cavity 115 has adiameter less than that of the first cavity 112 and a predetermineddepth. Here, the first and second cavities 112 and 115 may have the samesurface configuration, for example, a reflective cup having a circularshape or a polygonal shape, but the shape of the reflective cup is notlimited thereto.

As shown in FIG. 1, the second cavity 115 is located in approximately acentral portion of the package body 110. With respect to the line B-B ofFIG. 1 that approximately bisects the second cavity 115. Therein, afirst side of the first cavity 112 about the line B-B may be referredto, which contains both a portion of the second lead electrode 123 and aportion of the first lead electrode 121. The opposite side of the firstcavity 112 about the line B-B from the first side may be referred to asa second side, which contains the first lead electrode 121, but not thesecond lead electrode 123. The second cavity 115 straddles both thefirst and second sides of the first cavity 112.

The second cavity 115 contains a portion of a first lead electrode 121so that a first lead electrode 121 has a portion which cups the secondcavity 115. The portion of the first lead electrode 121 cups the secondcavity 115 by entirely covering a side surface and a bottom of thesecond cavity 121, but not the exposed top.

The first lead electrode 121 extends from one side of a bottom surfaceof the first cavity 112 to the other side thereof. A second cavity 115is defined between one side and the other side of the first cavity 112and has a predetermined depth. The first lead electrode 121 is formed ina side of the bottom surface of the first cavity 112, i.e., either anentire surface or a majority surface of the side of the bottom surfaceof the first cavity 112.

The first lead electrode 121 is spaced from the second lead electrode123 at the other side of the first cavity 112.

The first lead electrode 121 defines a bottom surface and acircumferential surface of the second cavity 115. That is, the firstlead electrode 121 forms the second cavity 115.

The second cavity 115 formed by the first lead electrode 121 may have avessel or cup shape having a smooth curvature. The first lead electrode121 may be perpendicular or inclined to a circumferential surface of thesecond cavity 115 in the bottom surface 111 of the package body 110.

The first lead electrode 121 may have the other end P1 exposed to oneside of the package body 110 and bent downwardly from the package body110 or bent toward a bottom surface of the package body 110. The otherend P1 of the first lead electrode 121 may be used as an externalelectrode.

Referring to FIG. 2, a portion of the first lead electrode 121constitutes or formed along a bottom surface and a circumferentialsurface of the second cavity 115, and a bottom surface 121A of thesecond cavity 115 is disposed on a bottom surface 111 of the packagebody 110, but such is not required. The first lead electrode 121 isdisposed under the light emitting device 130 within the second cavity115. Heat transferred from the light emitting device 130 may be radiatedto the outside through a bottom surface of the first lead electrode 121.Thus, heat may be effectively radiated through the first lead electrode121.

The bottom surface of the first lead electrode 121 disposed within thesecond cavity 115 may be flush with the bottom surface of the packagebody 110.

Referring to FIG. 1, the other end P1 of the first lead electrode 121 isspaced from one end of the second lead electrode 123. The first leadelectrode 121 constitutes a portion of the bottom surface of the firstcavity 112 or an entire surface of the second cavity 115.

The second lead electrode 123 has one end disposed on a portion of thefirst cavity 112 of the package body 110 and spaced a predetermineddistance from the first lead electrode 121. The second lead electrode123 may have the other end P2 exposed to the other side of the packagebody 110 and bent downwardly from the package body 110 or bent towardthe bottom surface of the package body 110. The other end P2 of thesecond lead electrode 123 may be used as a lead electrode.

The other end P1 of the first lead electrode 121 may be provided in oneor plurality and the other end P2 of the second lead electrode 123 maybe provided in one or plurality. That is, the other end P1 of the firstlead electrode 121 may be divided into a plurality of pieces, and theother end P2 of the second lead electrode 123 may be divided into aplurality pieces. As a result, electronic reliability may be improved.

The first and second lead electrodes 121 and 123 are separated from eachother at a portion of the first cavity 112 to form an opened structure.At least one light emitting device 130 is disposed on the first leadelectrode 121, and the light emitting device 130 is attached to thefirst lead electrode 121 using an adhesive. The light emitting device130 is connected to the first lead electrode 121 using a first wire 132and connected to the second lead electrode 123 using a second wire 134.Here, the first wire 132 is bonded to the first lead electrode 121 andthe light emitting device 130 within the second cavity 115. The secondwire 134 has one end bonded to the light emitting device 130 disposedwithin the second cavity 115 and the other end bonded to the second leadelectrode 123 disposed within the first cavity 112.

The first wire 132 may be disposed within the phosphor layer 140. Inthis case, since the first wire 132 is disposed within the phosphorlayer 140, defect occurrence and efficiency drooping due to the resinlayer 150 or the formation thereof may be reduced or prevented. Also,the first wire 132 may be disposed at a position higher or lower thanthat of a surface of the phosphor layer 140, but is not limited thereto.Here, since the first wire 132 is disposed within the second cavity 115or the phosphor layer 140, a wire bonding defect may be reduced orprevented, and also, light efficiency may be improved.

The light emitting device 130 may include at least one blue LED chip.Alternatively, a colored LED chip such as a green LED chip or a red LEDchip or an ultraviolet (UV) LED chip may be used as the light emittingdevice 130. A lateral-type semiconductor light emitting device will bedescribed below as an example of the LED chip.

Since the first wire 132 is disposed within the second cavity 115, thefirst wire 132 may be disposed further close to the light emittingdevice 130 and disposed on a layer different from the second wire 134.

The phosphor layer 140 is disposed within the second cavity 115, and theresin layer 150 is disposed within the first cavity 112. For example,the phosphor layer 140 may include a layer in which a yellow phosphor isadded to a resin material such as silicon or epoxy. The phosphor layer140 absorbs a portion of light emitted from the blue LED chip to emityellow light. For example, when the light emitting device 130 includesthe blue LED chip, and the phosphor layer 140 contains the yellowphosphor, the light emitting package 100 emits white light by mixingblue light with yellow light.

A surface of the phosphor layer 140 may have a flat shape, a concaveshape, or a convex shape, but is not limited thereto.

When the first wire 132 is disposed within the second cavity 115, it mayreduce or prevent a portion of a phosphor layer 140 dispensed ordisposed into the second cavity 115 from ascending along the first wire132 and the second wire 134. As a result, a color-coordinatedistribution of light emitted from the light emitting device 130 may bereduced.

When the first and second wires 132 and 134 are disposed within thefirst cavity 112, the phosphor layer 140 disposed in the second cavity115 may ascend along the first and second wires 132 and 134 during thedispensing or disposing process for the phosphor layer 140. As a result,the color-coordinate distribution through the phosphor layer 140 is wideto cause a non-uniform color-coordinate distribution of a white LED.Therefore, brightness and manufacturing yield may be reduced. Accordingto embodiments, the first wire 132 may be disposed within the secondcavity 115 to improve the color-coordinate distribution, the brightness,and the manufacturing yield.

According to the first embodiment, the second cavity 115 may be formedusing the first lead electrode 121 to increase a light reflectionamount.

The resin layer 150 may be disposed within the first cavity 112 andformed of the resin material such as the silicon (or silicon containing)or the epoxy, and in addition, the phosphor may be added or not be addedto the resin layer 150, but is not limited thereto. A surface of theresin layer 150 may have one of a flat shape, a concave shape R, aconvex shape, an irregular shape, or other shapes.

FIG. 4 is a plan view of a light emitting device according to a secondembodiment. In the description of a second embodiment, components andoperations equal to those of the first embodiment will be described withreference to the first embodiment, and duplicated descriptions will beomitted.

Referring to FIG. 4, a light emitting device package 101 includes apackage body 110 having a lower groove 111B, a first cavity 112, asecond cavity 115, lead electrodes 121 and 123, a light emitting device130, a phosphor layer 140, and a resin layer 150.

The lower groove 111B of the package body 110 may be stepped withrespect to an outer bottom surface 111A of the package body 110. Thelower groove 111B of the package body 110 may be concave to apredetermined depth with respect to the outer bottom surface 111A of thepackage body 110. The lower groove 111B and the outer bottom surface111A of the package body 110 have thicknesses different from each other.Due to such a thickness difference D1, a space is defined in the lowergroove 111B of the package body 110. As a result, a bottom surface 121Aof the first lead electrode 121 disposed within the second cavity 115 isexposed to the lower groove 111B of the package body 110.

Thus, heat is effectively radiated through the bottom surface 121A ofthe first lead electrode 121 disposed within the second cavity 115.Also, the lower groove 111B of the package body 110 may reduce orprevent the package body 110 from being short-circuited due to solderfailure when the package body 110 is mounted on a board PCB 105. A heatsink plate may be disposed in the lower groove 111B of the package body110.

The first lead electrode 121 has one end P3 disposed on the outer bottomsurface 111A of the package body 110, and the second lead electrode 123has the other end P4 disposed on the opposite outer bottom surface 111Aof the package body 110.

FIG. 5 is a plan view of a light emitting device according to a thirdembodiment. In the description of a third embodiment, components andoperations equal to those of the first embodiment will be described withreference to the first embodiment, and duplicated descriptions will beomitted.

Referring to FIG. 5, a light emitting device package 100A includes apackage body 110, a first cavity 112, a second cavity 115, leadelectrodes 121 and 123, a light emitting device 130, a phosphor layer, aresin layer 150, and a lens layer 160.

An injection molded part having a predetermined shape is disposed on thepackage body 110, and then, a transparent resin material is injectedthereon to form the lens layer 160 having a shape equal to that of aninner surface of the injection molded part.

The lens layer 160 has a structure that convexly protrudes in hemisphereshapes toward the outer sides of the package body 110 about the centeror a center portion of the package body 110 (when viewed from thepackage body). For example, the lens layer 160 may be formed in aparabolic shape having a smoothly bent or curved surface. In otherembodiments, an abruptly changing surface or a step surface is alsopossible.

The lens layer 160 condenses light emitted from the first cavity 112into a predetermined region. The configuration of the lens layer 160 isjust one example and is not limited to the parabolic shape.

FIG. 6 is a plan view of a light emitting device according to a fourthembodiment. In the description of a fourth embodiment, components andoperations equal to those of the first embodiment will be described withreference to the first embodiment, and duplicated descriptions will beomitted.

Referring to FIG. 6, a light emitting device package 100B includes apackage body 110, a first cavity 112, a second cavity 115, leadelectrodes 121 and 123, a light emitting device 130, a phosphor layer140, a resin layer 150, and a lens layer 160A.

The lens layer 160A is formed in a convex hemisphere shape on thepackage body 110. The lens layer 160A may be formed by an injectionmolded part and/or separately attached.

Referring to FIGS. 5 and 6, the lens layer 160 or 106A disposed on thepackage body 110 may be variously modified in configuration and is notlimited to the above-described structure.

FIG. 7 is a side view of a light emitting device according to a fifthembodiment.

Referring to FIG. 7, a light emitting device package 200 includes apackage body 210, a first cavity 212, a second cavity 215, leadelectrodes 221 and 223, a light emitting device 230, a phosphor layer240, and a resin layer 250.

The first cavity 212 having a predetermined depth is defined within thepackage body 210. The second cavity 215 having a predetermined depth isdefined in a central region of the first cavity 212.

A portion 216A of a lateral surface of the second cavity 215 may bedefined by the package body 210, and remaining portions of the secondcavity 215 may be defined by the first lead electrode 221 and thepackage body 210. That is, a side of the first lead electrode 221 may bestepped to constitute a bottom surface of the second cavity 215, andmost of the lateral surface of the second cavity 215 may be defined bythe package body 210. Also, a portion of the first lead electrode 221disposed within the second cavity 215 may be exposed to a bottom surfaceof the package body 210 to effectively radiate heat.

A groove 211 of the first cavity 212 is formed by an injection modelingto expose a portion of the second lead electrode 223. Here, most of abottom surface of the first cavity 212 may be defined by the packagebody 210.

The light emitting device 230 adheres to a top surface of the first leadelectrode 221 using an adhesive. The first wire 232 electricallyconnects the first lead electrode 221 to the light emitting device 230within the second cavity 215, and the second wire 234 electricallyconnects the second lead electrode 223 exposed to the groove 211 definedin the other side of the first cavity 212 to the light emitting device230.

The light emitting device 230 may include various color LED chips. For acase in which the light emitting device 230 is at least one blue LEDchip, the phosphor layer 240 to which a yellow phosphor is added isdisposed within the second cavity 215. At this time, since the firstwire 232 is disposed within the second cavity 215, it may reduce orprevent a portion of the phosphor layer 240 from ascending along thewires 232 and 234. Also, in the fifth embodiment, the package body 210may constitute all lateral surfaces 216A and 216 of the first cavity 212and the second cavity 215.

The resin layer 250 is disposed within the first cavity 212. The resinlayer 250 may be formed of a resin material such as a silicon resin oran epoxy resin, and in addition, the phosphor may be added or not beadded to the resin material, but is not limited thereto.

A lens layer may be disposed on the package body 210, but is not limitedthereto. Also, an outer bottom surface of the package body 210 may bestepped, like the second embodiment shown in FIG. 4.

FIG. 8 is a plan view of a light emitting device according to a sixthembodiment. In the description of the sixth embodiment, components andoperations equal to those of the first embodiment will be described withreference to the first embodiment, and duplicated descriptions will beomitted.

Referring to FIG. 8, a light emitting device package 300 includes apackage body 310, a first cavity 312, a second cavity 315, a lightemitting device 330, first and second lead electrodes 321 and 323, aphosphor layer 340, and a resin layer 350.

The package body 310 may be formed of a silicon material, for example,the package body 310 may be formed using a wafer level package (WLP)technology and have a polyhedral shape (e.g., hexahedral shape). Thefirst cavity 312 is defined inside an upper portion of the package body310, and a surface of the first cavity 312 may have a polygonal shape, acircular shape, an oval shape, an irregular shape, or other shapes. Thefirst cavity 312 may be formed with a predetermined depth using a dryetching process and/or a wet etching process, but is not limitedthereto.

A lateral surface 313 of the first cavity 312 may be perpendicular to orinclined to a bottom surface thereof, and the lateral surface 313 mayimprove a light reflection amount.

The second cavity 315 having a predetermined depth is defined under acentral region of the first cavity 312. The second cavity 315 may have apolygonal shape, a circular shape, an oval shape, an irregular shape, orother shapes. The second cavity 315 may be formed with a predetermineddepth using a dry etching process and/or a wet etching process.

A dielectric may be disposed on a surface of the package body 310, butis not limited thereto. The first lead electrode 321 and the second leadelectrode 323 are disposed on the surface of the package body 310.

The first lead electrode 321 is disposed on the other side surface ofthe package body 310, and the second lead electrode 323 is disposed onone side surface of the package body 310. The first lead electrode 321is disposed along a bottom surface and a lateral surface of the firstcavity 312 and along an outer surface of the other side of the packagebody 310 to extend up to a portion of a bottom surface of the packagebody 310.

The second lead electrode 323 is integrally disposed along a portion ofthe bottom surface of the first cavity 312, a lateral surface and abottom surface of the second cavity 315, and the outer surface of thepackage body 310 to extend up to a portion of the bottom surface of thepackage body 310.

A mask pattern may be disposed on the first lead electrode 321 and thesecond lead electrode 323 to form a metal electrode layer using sputterequipment, but is not limited thereto.

Outer ends P1 and P2 of the first lead electrode 321 and the second leadelectrode 323, which are disposed on the outer surface of the packagebody 310, may be used as external electrodes.

The light emitting device 330 adheres to the first lead electrode 321within the first cavity 312 using an adhesive. A first wire 332electrically connects the light emitting device 330 to the second leadelectrode 323. Here, since a bonding portion of the first wire 332 isconnected to the second lead electrode 323 within the second cavity 315,the first wire 332 may be disposed within the second cavity 315. Thus,it may reduce or prevent the phosphor layer 340 molded to the secondcavity 315 from ascending along the first wire 332 and a second wire334.

The second wire 334 electrically connects the light emitting device 330to the second lead electrode 321 within the first cavity 312.

The phosphor layer 340 is disposed within the second cavity 315, and acolored phosphor, for example, a yellow phosphor may be added to a resinmaterial such as silicon, silicon resin, or an epoxy to form thephosphor layer 340. Here, the resin layer 350 may be disposed before orafter the phosphor layer 340 is hardened.

The transparent resin layer 350 is disposed within the first cavity 312.The resin layer 350 may be formed of a resin material such as silicon orepoxy, and in addition, the phosphor may be added or not added to theresin material, but is not limited thereto.

Since the first wire 332 is disposed within the second cavity 315including the phosphor layer 340, it may reduce or prevent the phosphorlayer 340 from ascending along the wires 332 and 334 to a predeterminedheight.

The phosphor layer 340 may have a flat shape, and the resin layer 350may have one of a flat shape, concave shape, and a convex shape.

Technical characteristics of the first to fifth embodiments are notlimited to each embodiment, but may be applicable to other embodiments.Such a selective application will be included in technical scopes of theembodiments.

The light emitting device package according to the first to fifthembodiments may be realized in a top view or side view type. Also, thelight emitting device package may be disposed in an array form in aportable terminal, a notebook computer, etc. Thus, the light emittingdevice package may be provided as a lighting unit or variouslyapplicable to devices such as an illumination device, an indicationdevice, etc.

According to the embodiments, the color-coordinate distribution of thewhite light of the light emitting device package may be minimized.

According to the embodiments, the light emitting device package mayimprove the color-coordinate yield of the white light.

According to the embodiments, the color-coordinate yield may beimproved, and the heat may be effectively radiated to improve thereliability of the light emitting device package.

Embodiments may provide the light emitting device package using the LED.

Embodiments may be applicable to the lighting unit such as displaydevices, illumination devices, and indication devices, etc.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A semiconductor light emitting device package,comprising: a first lead electrode; a second lead electrode; at leastone light emitting device disposed on the first lead electrode; apackage body having a cavity; and a resin material disposed in thecavity, wherein the cavity comprises a first cavity and a second cavityconnected to the first cavity, wherein the first cavity is positioned ina central portion of the package body, wherein the second cavity isformed under a central portion of the first cavity, wherein a bottomsurface of at least one of the first lead electrode or the second leadelectrode is exposed to a bottom surface of the package body, whereinthe first lead electrode and the second lead electrode are separatedfrom each other by a gap, and a portion of the package body is disposedin the gap, wherein the first lead electrode comprises a recessedportion covering a side surface and a bottom surface of the secondcavity, wherein a bottom surface of the recessed portion of the firstlead electrode is flush with the bottom surface of the package body, andwherein a lowermost surface of at least one of the first lead electrodeor the second lead electrode extended to an outside of the package bodyis lower than the bottom surface of the at least one of the first leadelectrode or the second lead electrode.
 2. The semiconductor lightemitting device package according to claim 1, wherein the bottom surfaceof the package body has a recessed bottom portion with reference toedges of the package body.
 3. The semiconductor light emitting devicepackage according to claim 1, wherein the first cavity is larger thanthe second cavity.
 4. The semiconductor light emitting device packageaccording to claim 1, wherein a surface of the resin material comprisesa concave shape.
 5. A semiconductor light emitting device package,comprising: a first lead electrode; a second lead electrode; at leastone light emitting device disposed on the first lead electrode; apackage body having a cavity; and a resin material disposed in thecavity, wherein the cavity comprises a first cavity and a second cavityconnected to the first cavity, wherein the first cavity is positioned ina central portion of the package body, wherein the second cavity isformed under a central portion of the first cavity, wherein a bottomsurface of at least one of the first lead electrode or the second leadelectrode is exposed to a bottom surface of the package body, whereinthe first lead electrode and the second lead electrode are separatedfrom each other by a gap, and a portion of the package body is disposedin the gap, wherein the first lead electrode comprises a recessedportion covering a side surface and a bottom surface of the secondcavity, wherein a bottom surface of the recessed portion of the firstlead electrode is flush with the bottom surface of the package body, andwherein the bottom surface of the package body has a recessed bottomportion with reference to edges of the package body.
 6. Thesemiconductor light emitting device package according to claim 5,wherein the at least one of the first lead electrode or the second leadelectrode extends from the cavity to an outside of the package body. 7.The semiconductor light emitting device package according to claim 5,further comprising: a phosphor layer disposed in the second cavity; anda first wire disposed within the phosphor layer.
 8. The semiconductorlight emitting device package according to claim 5, wherein the firstcavity is larger than the second cavity.
 9. The semiconductor lightemitting device package according to claim 5, wherein the recessedportion entirely covers the side surface and the bottom surface of thesecond cavity.
 10. The semiconductor light emitting device packageaccording to claim 5, wherein the second lead electrode comprises afirst end disposed on the first cavity, and a second end extended fromthe first end to an outside of the package body.
 11. The semiconductorlight emitting device package according to claim 5, wherein the packagebody is disposed on a printed-circuit board (PCB).
 12. The semiconductorlight emitting device package according to claim 5, wherein a lowermostsurface of at least one of the first lead electrode or the second leadelectrode extended to an outside of the package body is lower than thebottom surface of the at least one of the first lead electrode or thesecond lead electrode.
 13. The semiconductor light emitting devicepackage according to claim 5, wherein a surface of the resin materialcomprises a concave shape.
 14. The semiconductor light emitting devicepackage according to claim 13, wherein the package body is disposed on aprinted-circuit board (PCB).
 15. The semiconductor light emitting devicepackage according to claim 5, wherein the package body includes a stepportion disposed under the first cavity, and wherein the first leadelectrode includes a third end disposed on the step portion of thepackage body.
 16. The semiconductor light emitting device packageaccording to claim 15, wherein the step portion of the package body isdisposed between the lower recess and the first cavity.